AnandTech - 首页-头头体育滚球官网|英超联赛、西甲联赛、世界杯等赛事滚球直播吧! This channel features the latest computer hardware related articles. en-us Copyright 2019 AnandTech Anand Lal Shimpi AnandTech - 首页-头头体育滚球官网|英超联赛、西甲联赛、世界杯等赛事滚球直播吧! Japan’s Ministry Approves Shipments of Industrial Chemicals to South Korea - 首页-头头体育滚球官网|英超联赛、西甲联赛、世界杯等赛事滚球直播吧! Anton Shilov

Amidst the ongoing trade conflict between Japan and South Korea, there is some good news to close the week out. The Japanese Ministry of Economy, Trade and Industry has approved a new shipment of industrial chemicals to South Korea, which the latter country's high-tech manufacturers rely on for the ongoing production of processors and other components. This is the first of shipment to be approved since early July, when a diplomatic conflict between the two countries broke out. If South Korean manufacturers get the materials on time, it will help to avoid a painful disruption in the manufacturing and shipping of various tech components, including DRAM, NAND flash, LSI chips, and display panels.

Starting as of early July, Japanese producers must now get approval for individual exports to South Korea of polyimides (used both for LCDs and OLEDs), photoresists, and high-purity hydrogen fluoride (used to make chips, such as LSI, DRAM and NAND devices). The major Japanese manufacturers — JSR, Showa Denko (SDK), and Shin-Etsu Chemical — not only control the lion’s share of the global supply for these chemicals, but they also are among the only suppliers that can meet the quality needs that companies like LG, Samsung, and SK Hynix have built their manufacturing lines around.

Export reviews in Japan may take up to three months, whereas South Korean makers typically only keep one to two months' worth of materials in stock because they are highly toxic and uneasy to store. Luckily, the first individual exports was approved by the ministry in about four weeks. The review by the officials concluded that the shipments will not be used for military purposes. However, the ministry did not disclose what specific chemicals are set to ship. Presumably, the South Korean giants will get their needed materials shortly.

Here is what trade minister Hiroshige Seko told local journalists.

“Usually we do not make an announcement when any single export is approved. But in extraordinary circumstances, in which the South Korean government unjustly called our measures an export ban, we decided to make an announcement.”

One thing to keep in mind is the starting from July all individual exports from Japan to South Korea will have to be approved separately, which means these shipments will have to pass export review procedures every few weeks.

Related Reading:

Source: The Japan Times

]]> Fri, 09 Aug 2019 12:00:00 EDT tag:头头体育滚球官网,14730:news
Samsung Preps PM1733 PCIe 4.0 Enterprise SSDs For AMD's "Rome" EPYC Processors - 首页-头头体育滚球官网|英超联赛、西甲联赛、世界杯等赛事滚球直播吧! Anton Shilov

With the launch of AMD's new second generation "Rome" EPYC processors, AMD's numerous hardware partners have been lining up to announce their own wares built around the new processors. And this doesn't just go for OEMs and integrators, but it also extends to component suppliers who have been eagerly awaiting the first x86 server processor with PCIe 4.0 support. To that end, yesterday Samsung sent out an announcement confirming that their previously announced PM1733 enterprise SSD supports AMD's new processors, and that just in time for inclusion in Rome systems, they'll be shipping this quarter.

Samsung first announced the PM1733 last fall, as part of its general SSD roadmap update for the then-forthcoming year. The PM1733 is the successor to their PM1723b enterprise SSD, and is designed to take advantage of the bandwidth advances provided by PCIe 4.0. Based on the company’s proprietary controller and paired with 512 Gb 5th Generation V-NAND memory chips, the drive family is rated for read speeds of up to 8 GB/second.

Interestingly, Samsung is offering both PCIe 4.0 x4 and x8 versions of the SSDs, with the U.2 versions using a x4 interface while the alf-length half-height (HHHL) card versions will use x8. The U.2 drives with dual-port capability will offer capacities of up to 30.72 TB, whereas the HHHL cards will carry up to 15.36 TB of useful V-NAND flash.

Overall, Samsung's focus on the drive in terms of specifications is on the drive's read performance rather than its write performance. Along with its 8 GB/sec rated sequential read speed, Samsung says the PM1733 can handle random reads of up to 1500K IOPS, which would make the PM1733 among the fastest drives announced so far.

Samsung will start shipments of its PM1733 SSDs this quarter. Among x86 platforms, the PCIe 4.0 capabilities of the drives will only be available on AMD EPYC 7002 and AMD Ryzen 3000 platforms, but the devices will also work with current PCIe 3.0 platforms from Intel and AMD. The manufacturer has not disclosed prices of the new PM1733 SSDs so far.

Related Reading:

Source: Samsung

]]> Fri, 09 Aug 2019 10:00:00 EDT tag:头头体育滚球官网,14729:news
Phison Previews Next-Gen PCIe 4.0 SSD Controllers: Up to 7 GB/s, NVMe 1.4 - 首页-头头体育滚球官网|英超联赛、西甲联赛、世界杯等赛事滚球直播吧! Billy Tallis & Anton Shilov

At FMS 2019, Phison shared the specs for its next generation of client SSD controllers. The PS5018-E18 high-end controller will be made using a FinFET process technology and promises to boost sequential read and write performance of drives to 7 GB/s. The PS5019-E19T mainstream controller will be a quick follow-up to the E13T that is currently in production but has not yet shipped in retail products.

With its PS5016-E16 chip, Phison was the first to introduce client SSD controllers with a PCIe 4.0 x4 interface and is currently enjoying its unique position on the market. The PS5016-E16 is essentially an update of the PS5012-E12 — still featuring two Arm Cortex-R5 cores, eight NAND channels rated at 800 MT/s and made using TSMC’s 28 nm process technology, but now featuring a PCIe 4.0 x4 PHY and enhanced error correction capabilities. In the coming months, Phison's entry-level NVMe controller will get a similar successor: the new PS5019-E19T will be based on the PS5013-E13T (one Arm Cortex-R5 core, four NAND channels, 28nm technology), but featuring a new PCIe 4.0 x4 PHY and thus enabling cost-effective yet fast SSDs.

Phison’s next-generation PS5018-E18 high-end client SSD controller with a PCIe 4.0 x4 interface will be significantly different from the current E16. The chip gains a third Arm Cortex-R5 core, NVMe 1.4 compliance, improved hardware security algorithms, and will be made using TSMC’s 12 FFC fabrication process.

The most important improvement in the new controllers is support for faster NAND interface speeds of up to 1200 MT/s. This is necessary to get full performance out of 96L and newer 3D NAND. For the high-end E18 this allows the controller to actually deliver twice the throughput of any PCIe 3.0 x4 drive, where the E16 can only use a fraction of the extra bandwidth provided by the PCIe 4.0 upgrade. The faster NAND interface also allows the E19T to hit sequential speeds that are slightly faster than a PCIe 3.0 x4 link can handle, despite the E19T having only four NAND channels instead of the eight channels used by high-end NVMe controllers.

Peak power consumption for both the E19T and E18 will be higher than for their respective predecessors, but that's because they are so much faster; the newer controllers will actually be more efficient.

Phison's booth at FMS included live demos of the E13T, E19T and E16 controllers, but the E18 controller was not in attendance. The low-end E19T controller will be sampling by the end of the year and is likely to show up in retail drives by the end of Q1 2020. This means that the E13T is likely to be very short-lived in the retail market. The high-end E18 will be arriving a bit later, sampling in Q1 2020 and hitting the shelves in Q3, a year after the E16 it replaces.

Phison NVMe SSD Controller Comparsion
  E8/E8T E13T E19T E12 E16 E18
Market Segment Mainstream Consumer High-End Consumer
40 nm 28nm 28 nm 28 nm 12 nm FFC
CPU Cores 2x Cortex R5 1x Cortex R5 1x Cortex R5 2x Cortex R5 3x Cortex R5
Error Correction StrongECC 4th Gen LDPC 3rd Gen LDPC 4th Gen LDPC
E8T: No
Host Interface PCIe 3.0 x2 PCIe 3.0 x4 PCIe 4.0 x4 PCIe 3.0 x4 PCIe 4.0 x4
NVMe Version NVMe 1.2 NVMe 1.3 NVMe 1.4 NVMe 1.3 NVMe 1.4
NAND Channels, Interface Speed 4 ch,
533 MT/s
4 ch,
800 MT/s
4 ch,
1200 MT/s
8 ch,
667 MT/s
8 ch,
800 MT/s
8 ch,
1200 MT/s
Max Capacity 2 TB 2 TB 2 TB 16 TB 16 TB 16 TB
Sequential Read 1.6 GB/s 2.5 GB/s 3.75 GB/s 3.4 GB/s 5.0 GB/s 7.0 GB/s
Sequential Write 1.3 GB/s 2.1 GB/s 3.75 GB/s 3.2 GB/s 4.4 GB/s 7.0 GB/s
4KB Random Read IOPS E8: 240k
E8T: 120k
350k 440k 700k 750k 1M IOPS
4KB Random Write IOPS E8: 220k
E8T: 130k
450k 500k 600k 750k 1M IOPS
Controller Power 1.8 W 1.2 W 1.6 W 2.1 W 2.6 W 3.0 W
Sampling Q2 2017 Q2 2019 Q4 2019 Q2 2018 Q1 2019 Q1 2020
Retail SSD
Q4 2017 Q4 2019 Q1 2020 Q4 2018 Q3 2019 Q3 2020

Related Reading:

]]> Fri, 09 Aug 2019 08:00:00 EDT tag:头头体育滚球官网,14728:news
Dell’s XPS 13 2-in-1 7390 Available: Intel’s 10th Gen Core CPUs Inside - 首页-头头体育滚球官网|英超联赛、西甲联赛、世界杯等赛事滚球直播吧! Anton Shilov

Being one of Intel’s key partners, Dell is usually among the first PC makers to start selling computers based on the latest processors from the developer. On Thursday the company began to take orders for its new XPS 13 2-in-1 model 7390 convertible laptop, which is powered by Intel’s "Ice Lake" 10th Generation Core processors. With shipping dates listed for early September, it looks like Intel and its OEM partners will not only meet their "holiday 2019" commitment for Ice Lake, but will be able to get machines into consumers' hands before the summer is even out.

Re-engineered both inside and outside, the latest XPS 13 7390-series 2-in-1 convertibles come in a CNC-machined silver or black aluminum body that features either a fiber composite arctic white woven glass fiber palm rest. The notebooks are equipped with a custom 13.4-inch display panel with InfinityEdge bezels that is 7% larger than on the previous-generation model. The LCD panels feature a 1920×1200 or 3840×2400 resolution, 500 nits brightness, a 1500:1 or 1800:1 contrast ratio, a 16:10 aspect ratio, wide viewing angles as well as Dolby Vision on the FHD+ or 90% DCI-P3 on the UHD+ SKU.

At the heart of the new Dell XPS 13 2-in-1 7390-series convertible notebook are Intel’s Ice Lake-based 10th Gen Core i3/i5/i7 processors. Interestingly, Dell is only offering a single CPU with a better than UHD Graphics (32 EUs) configuration, with that being the Iris Plus (64 EU) i7-1065G7. The only i5 Dell offers is the i5-1035G1, which is the lowest-end i5, and the only way to get better graphics on XPS models that don't ship with the i7 by default is to pay a further $250 premium to upgrade to an i7.

Moving on, in terms of construction, these new Ice Lake processors are installed onto a more compact motherboard that allowed Dell to make the laptop 7% thinner while making the keyboard and the screen larger. The CPUs are cooled down using a brand-new cooling system that is comprised of two fans, an ultra-thin vapor chamber, and GORE thermal insulation to guarantee consistent performance even under high loads.

The Ice Lake processors inside the XPS 13 2-in-1 7390-series hybrid notebooks are paired with up to 32 GB of soldered-down LPDDR4X-3733 memory as well as a PCIe SSD of up to 1 TB capacity. As for connectivity, the XPS 13 2-in-1 7390-series features a Killer AX1650 Wi-Fi 6 + Bluetooth controller, two Thunderbolt 3 ports, a microSD card reader, a 3.5-mm jack for headsets, and other options. When it comes to multimedia capabilities, the new convertible has speakers, a microphone array, and a webcam (which is now located on top of the LCD).

Being very portable, the new laptop features a 7 – 13 mm z-height and weight starting at 1.32 kilograms (2.9 pounds). Meanwhile, the 2019 Dell XPS 13 7390-series 2-in-1 hybrid notebook comes with a 51 Wh battery that promises to last for up to 16 hours (real-world battery life will depend on the usage model, of course).

Dell’s XPS 7390-series 2-in-1 convertible notebooks are available starting at $999.99 for an entry-level SKU and going up for higher-end models.

Specifications of the Dell XPS 13 2-in-1 7390
  General Specifications
LCD Diagonal 13.4-inch
Resolution 1920×1200 3840×2400
Brightness 500 cd/m²
Contrast Ratio 1800:1 1500:1
Color Gamut ? 100% sRGB
90% DCI-P3
Features Dolby Vision HDR HDR400
Touch Support Yes
Protective Glass Corning Gorilla Glass 5
CPU  Intel’s 10th Gen Core i3-1005G1
 Intel’s 10th Gen Core i5-1035G1
 Intel’s 10th Gen Core i7-1065G7
Graphics Intel's UHD Graphics (G1) or Iris Plus (G7) GPU
RAM 4 GB LPDDR4 SDRAM at 3733 MT/s
8 GB LPDDR4x SDRAM at 3733 MT/s
16 GB LPDDR4x SDRAM at 3733 MT/s
32 GB LPDDR4x SDRAM at 3733 MT/s
Storage 256 GB PCIe 3.0 x4 SSD (onboard)
512 GB PCIe 3.0 x4 SSD (onboard)
1 TB PCIe 3.0 x4 SSD (onboard)
Wireless Killer AX1650 Wi-Fi 6 + Bluetooth 5.0 (based on Intel's silicon)
USB 3.1 2 × TB 3/USB Gen 3.1 Gen 2 Type-C
3.0 -
Thunderbolt 2 × TB 3 (for data, charging, DP displays)
Cameras Front 720p HD webcam
Other I/O Microphone, 2 stereo speakers, audio jack
Battery 51 Wh
Dimensions Width 29.7 cm | 11.69 inches
  Depth 20.7 cm | 8.15 inches
  Thickness 7 - 13 mm | 0.28 - 0.51 inches
Weight 1.32 kilograms | 2.9 pounds
Launch Price Starting at $999

Related Reading:

Source: Dell

]]> Thu, 08 Aug 2019 10:00:00 EDT tag:头头体育滚球官网,14727:news
Lenovo Launches ThinkSystem SR635 & SR655 Servers with AMD’s EPYC ‘Rome’ CPUs - 首页-头头体育滚球官网|英超联赛、西甲联赛、世界杯等赛事滚球直播吧! Anton Shilov

Lenovo on Wednesday introduced its first servers based on AMD’s EPYC 7002-series ‘Rome’ processors, which offer up to 64 cores and 128 PCIe 4.0 lanes. The single-socket ThinkSystem SR635 and SR655 machines are designed for a wide variety of applications, including analytics, HPC, virtualized environments and scale-out software-defined storage.

Lenovo’s ThinkSystem SR635 is a 1U server featuring 16 DDR4 DIMMs supporting up to 1 TB of memory using 64 GB RDIMMs, 16 2.5-inch NVMe drives (or four 3.5-inch drives), M.2 boot drives three PCIe 4.0 x16 slots (for three single-wide graphics cards), one PCIe x8 slot, one OCP mezzanine slot, and other I/O capabilities.

The ThinkSystem SR655 is a larger 2U machine featuring 16 DDR memory slots for 1 TB of DRAM, up to 20 3.5-inch or 32 2.5-inch NVMe storage drives, six PCIe 4.0 slots for single-wide GPUs, an OCP 3.0 connector, and other I/O means.

Both ThinkSystem SR635 and ThinkSystem SR655 support hardware RAID flash cache as well as regular set of server connectors along with Aspeed’s AST2500 BMC. Depending on configuration, the machines can be equipped with up to a 1100 W PSU. As for software compatibility, the systems can run Microsoft Windows Server, SUSE Linux Enterprise Server, Red Hat Enterprise Linux, and VMware vSphere.

Covered with a one or three-year warranty, the ThinkSystem SR635 and SR655 machines will be available shortly. Prices will depend on configurations of servers.

Related Reading:

Source: Lenovo

]]> Thu, 08 Aug 2019 09:00:00 EDT tag:头头体育滚球官网,14725:news
Samsung Announces Always-Connected Galaxy Book S Laptop with Snapdragon 8cx - 首页-头头体育滚球官网|英超联赛、西甲联赛、世界杯等赛事滚球直播吧! Anton Shilov

Samsung has introduced its new always-connected PC based on Qualcomm’s Snapdragon platform and featuring Microsoft’s Windows 10 OS. This time around the company went with the Snapdragon 8cx SoC, a clamshell form-factor, and a 13.3-inch display, emphasizing that its Arm-powered computers compete against mainstream x86-based laptops in terms of performance and capabilities. Like other Snapdragon-based Windows machines, Samsung is aiming for long battery lifetimes here, with the new Galaxy Book S rated to work for up to 23 hours on a single charge.

The Samsung Galaxy Book S is equipped with a 13.3-inch Full-HD LCD featuring a 10-point multi touch system and a 16:9 aspect ratio. By contrast, last year’s Galaxy Book2 used a 12-inch Super AMOLED display featuring a 2160×1440 resolution and a 3:2 aspect ratio. Unlike last year’s mobile PC, the new one is a laptop, not a convertible, so it cannot be used as a tablet. Considering that we are talking about an aluminum machine with a 13.3-inch display that weighs 0.96 kilograms, the clamshell form-factor makes more sense for mainstream users. Furthermore, the overall construction looks very solid.

The new Galaxy Book S laptop is expected to be considerably faster than its predecessor as it is based on Qualcomm’s Snapdragon 8cx processor with eight general purpose cores (four Cortex-A76 and four Cortex-A55-class cores), a 10 MB L3 cache, the Adreno 680 GPU, and an eight-channel LPDDR4X-4266 memory controller. The SoC is accompanied by 8 GB of RAM as well as 256 GB or 512 GB of NAND flash storage (expandable with a microSD card).

When it comes to wireless connectivity, the Samsung Galaxy Book S includes Snapdragon X20 LTE modem (Cat 18, 5CA, 4x4 MIMO, depending on the market and operator), 802.11ac Wi-Fi, and Bluetooth 5.0. The PC’s wired connectivity department is limited to USB Type-C that is used for data and charging, a microSD card slot, yet we do not know whether it has a 3.5-mm audio connector.

As far as imaging and multimedia capabilities are concerned, the Galaxy Book S has a 720p webcam, a built-in microphone as well as Dolby Atmos-badged stereo speakers co-designed with AKG. The laptop also has a Windows Hello-compatible fingerprint reader.

Apart from performance, one of the key improvements of the Galaxy Book S compared to its predecessor is its longer battery life. The PC comes with a 42 Wh battery that enables it to work for up to 23 hours (based on tests conducted by Samsung), up from 20 hours for last year's device.

Specifications of the Galaxy Book S
  General Specifications
Display 13.3-inch,
165 PPI
CPU Qualcomm Snapdragon 8cx
4 x Kryo 495 Gold at 2.84 GHz
4 x Kryo 495 Silver at 1.8 GHz
10 MB L3
Graphics Adreno 680 GB
Storage 256 - 512 GB
Wi-Fi 802.11ac Wi-Fi
Bluetooth 5.2
WWAN Qualcomm X20 Gigabit LTE
Cat 18, 5CA, 4x4 MIMO, up to 1.2 Gbps DL, up to 150 Mbps UL
USB 3.0 ? × Type-C
Webcam 720P
Other I/O Microphone, stereo speakers, trackpad, MicroSD card reader, etc.
Battery 42 Wh
Battery Life 23 hours
Dimensions Width 305.2 mm
Height 203.2 mm
Thickness 6.2 - 11.8 mm
Weight 960 grams
Price ?

Samsung will start sales of the Galaxy Book S in two colors this Fall. Pricing of the device is currently unknown.

Related Reading:

Source: Samsung

]]> Thu, 08 Aug 2019 08:00:00 EDT tag:头头体育滚球官网,14726:news
AMD Rome Second Generation EPYC Review: 2x 64-core Benchmarked - 首页-头头体育滚球官网|英超联赛、西甲联赛、世界杯等赛事滚球直播吧! Johan De Gelas If you examine the CPU industry and ask where the big money is, you have to look at the server and datacenter market. Ever since the Opteron days, AMD's marketshare has been rounded to zero percent, and with its first generation of EPYC processors using its new Zen microarchitecture, that number skipped up a small handful of points, but everyone has been waiting with bated breath for the second swing at the ball. AMD's Rome platform solves the concerns that first gen Naples had, plus this CPU family is designed to do many things: a new CPU microarchitecture on 7nm, offer up to 64 cores, offer 128 lanes of PCIe 4.0, offer 8 memory channels, and offer a unified memory architecture based on chiplets. Today marks the launch of Rome, and we have some of our own data to share on its performance.

]]> Wed, 07 Aug 2019 19:00:00 EDT tag:头头体育滚球官网,14694:news
The AMD 2nd Gen EPYC "Rome" Launch Live Blog - 首页-头头体育滚球官网|英超联赛、西甲联赛、世界杯等赛事滚球直播吧! Ryan Smith The second – and arguably largest – shoe in the Zen 2 launch is dropping today: AMD’s EPYC 7002-series “Rome” processor. Based on all the things that made 3rd gen Ryzen great just a month ago, now AMD is doing it bigger and better. With up to 64 cores, AMD will be striking right at the heart of Intel’s server CPU business; and they just might be able to do it.

]]> Wed, 07 Aug 2019 16:55:00 EDT tag:头头体育滚球官网,14724:news
Samsung Announces Galaxy Note10 & Note10+: A Redesign With Feature Disparity - 首页-头头体育滚球官网|英超联赛、西甲联赛、世界杯等赛事滚球直播吧! Andrei Frumusanu It’s that time of the year again. We’ve made it past the first half of 2019 and all vendors have released their initial flagship devices for the year. Samsung was amongst the first to usher in the new generation with the Galaxy S10, S10+ and S10e, and as has been traditional for many years, it’s now time for a refresh of Samsung’s second flagship lineup - the Galaxy Note. Today Samsung is unveiling two new devices: the new Galaxy Note10 and Note10+, marking a significant departure from its usual Note device formula.

]]> Wed, 07 Aug 2019 16:15:00 EDT tag:头头体育滚球官网,14712:news
Western Digital Reveals Ultrastar DC SN340 SSDs for Read Intensive Workloads - 首页-头头体育滚球官网|英超联赛、西甲联赛、世界杯等赛事滚球直播吧! Anton Shilov

Western Digital has introduced its new accelerator drives designed for very read-intensive workloads. The key feature of the Ultrastar DC SN340 Very Read Intensive (VRI) SSDs is their low read latency which is important for write-once read many applications, such as video-on-demand services, distributed databases, and emerging AI/ML workloads.

Nowadays video streaming providers use 1 TB SATA SSDs that offer a ratio of IOPS to bandwidth that satisfies their needs in terms of numbers of parallel users/streams (RIOPS). In a bid to optimize power, costs, and the number of racks in their datacenters while still meeting their requirements, VOD services need higher-capacity drives with higher performance and specific functionality. Western Digital believes that VRI SSDs is a type of devices that will satisfy requirements of the aforementioned (and many other read-intensive) workloads.

Carrying 3.84 or 7.68 TB of usable capacity, Western Digital’s Ultrastar DC SN340 U.2 drives optimized for write-once read many workloads are based on the company’s proprietary controller as well as 96-layer BiCS4 3D TLC NAND. With up to 3.3 GB/s sequential read speed, up to 1.5 GB/s write speed, up to 420K random read IOPS, and a 6.5 W maximum power consumption, the Ultrastar DC SN320 are substantially faster and more power efficient than SATA SSDs used by various VOD companies today.

One key thing to note about the Ultrastar DC SN340 is that it requires all requests to be 32 KB aligned to guarantee consistent performance and appropriate endurance, so these drives are not for everyone. This is a result of the drive's Flash Translation Layer (FTL) managing data with a coarser granularity, which significantly reduces the size of the indirection tables and allows the drive to operate with less DRAM than the usual 1GB per 1TB ratio.

In addition to video streaming services, VRI SSDs can be used for other write-once read many applications. Distributed No-SQL Databases (Apache Cassandra, MongoDB, etc.) that sequentially write in append mode and avoid overwrites can benefit from such drives and their low read latency. Furthermore, various AI and ML applications that use training while performing loads of reads also take advantage of VRI drives.

Western Digital's Ultrastar DC SN340 SSDs
Capacities 3,840 GB
7,680 GB
Interface PCIe 3.0 x4 (NVMe)
Controller Proprietary
Sequential Read up to 3300 MB/s
Sequential Write up to 1500 MB/s
Random Read (32 KB) IOPS up to 420K IOPS
Random Write (32 KB) IOPS up to 7K IOPS
Mixed Random Read/Write
(max IOPS 70%R/30%W, 32KB)
up to 139K IOPS
Power Active 6.5 W
MTBF 2 million hours
Warranty Five years
Note: Performance numbers are based on 7.68 TB U.2 SSD

Western Digital does not disclose when it plans to start volume production of its Ultrastar DC SN340 VRI SSDs, but it is logical to assume that when its customers learn how to better use such drives, these products will be made available.

Related Reading:

Source: Western Digital

]]> Wed, 07 Aug 2019 14:00:00 EDT tag:头头体育滚球官网,14723:news
Western Digital Unveils Ultrastar DC SN640 SSDs: Up to 30.72 TB Capacity - 首页-头头体育滚球官网|英超联赛、西甲联赛、世界杯等赛事滚球直播吧! Anton Shilov

Western Digital has announced its new family of enterprise SSDs aimed at mixed-use-case workloads. The new drives use in-house developed components and come in EDSFF E1.L, U.2, and M.2-22110 form-factors offering capacities of up to 30.72 TB.

Based on controllers developed by Western Digital internally as well as 96-layer BICS4 3D TLC NAND, the Ultrastar DC SN640 SSDs are aimed at performance-demanding business-critical mixed-workload applications, including SQL Server, MySQL, VMware vSAN, Microsoft Azure Stack HCI solutions, virtual desktops, and other. When it comes to feature set, the drives support power loss protection, AES-256 data encryption, Instant Secure Erase, signed firmware downloads, and other technologies.

Depending on target applications, Western Digital will offer its Ultrastar DC SN640 in three form-factors. For those who need maximum performance and capacity, the manufacturer will offer SSDs in EDSFF E1.L form-factor that will offer capacities of up to 30.72 TB as well as up to 720K random read IOPS. For blade servers running virtual desktops and similar software the maker will offer U.2 SSDs featuring up to 7.68 TB capacities. For space-constrained and OCP environments, the Ultrastar DC SN640 drives will be available in M.2-22110 form-factor as well as capacities of up to 3.84 TB. Considering the workloads, the new SSDs offer tunable endurance of 0.8 or 2 DWPD over five years.

As far as performance is concerned, the Ultrastar DC SN640 6.4 TB U.2 SSD is rated for up to 3.2 GB/s sequential read speeds, up to 2.14 GB/s sequential write speeds, up to 480K random read IOPS, and up to 120K random write IOPS.

Western Digital's Ultrastar DC SN640 SSDs
M.2-22110 EDSFF E1.L
Capacities 0.8 DWPD 800 GB
1,600 GB
3,200 GB
6,400 GB
960 GB
1,600 GB
3,840 GB
7.68 TB
15.36 TB
30.72 TB
2 DWPD 960 GB
1,920 GB
3,840 GB
7,680 GB
- -
Interface PCIe 3.0 x4 (NVMe)
Controller Proprietary
Sequential Read up to 3200 MB/s
Sequential Write up to 2140 MB/s
Random Read (4 KB) IOPS up to 480K IOPS
Random Write (4 KB) IOPS up to 120K IOPS
Mixed Random Read/Write
(max IOPS 70%R/30%W, 4KB)
up to 240K IOPS
Power Active 12 W 8.25 W 20 W
Encryption AES-256
Power Loss Protection Yes
MTBF 2 million hours
Warranty Five years
Note: Performance numbers are based on 6.4 TB U.2 SSD

Samples of Western Digital’s Ultrastar DC SN640 SSDs are now available to the company’s customers and will ship commercially later.

Related Reading:

Source: Western Digital

]]> Wed, 07 Aug 2019 13:00:00 EDT tag:头头体育滚球官网,14718:news
Sharp to Supply IGZO Displays to Nintendo - 首页-头头体育滚球官网|英超联赛、西甲联赛、世界杯等赛事滚球直播吧! Anton Shilov

In a surprising move, one of Sharp’s top executives revealed that the company will supply its IGZO displays to Nintendo. Usage of IGZO screens promises to reduce power consumption of Nintendo’s game consoles, though it is unclear which model will get a new type of LCD first.

Katsuaki Nomura, an executive vice president of Sharp, told the Wall Street Journal that the company would supply its IGZO displays to Nintendo. The exec did not disclose specifications of the panel or which of Nintendo’s consoles will get IGZO displays first.

The game console maker is about to release a handheld-only version of its Switch game console as well as a new version of the fully-fledged Switch. Both new devices could benefit of Sharp’s IGZO displays because of their lower power consumption and potentially higher image quality, but it remains to be seen whether Nintendo decides to shift both of its upcoming game consoles to a new type of LCDs.

The upcoming versions of Nintendo’s Switch promise considerably longer battery life when compared to existing Switch consoles while using similar batteries. One of the key reasons why the new units feature lower power consumption is believed to be a new SoC from NVIDIA.

Sharp and Nintendo have a long history of working together as the former designed auto stereoscopic display for the latter's 3DS console.

Related Reading:

Source: Wall Street Journal

]]> Wed, 07 Aug 2019 11:00:00 EDT tag:头头体育滚球官网,14722:news
Samsung Announces the Exynos 9825 SoC: First 7nm EUV Silicon Chip - 首页-头头体育滚球官网|英超联赛、西甲联赛、世界杯等赛事滚球直播吧! Andrei Frumusanu

This year’s Galaxy S10 has been in a bit of an odd situation: Although Samsung continued to dual-source its SoCs, using both its own Exynos 9820 SoC as well as Qualcomm’s Snapdragon 855, the phone found itself in the unusual situation of pitting 8nm silicon against 7nm silicon from TSMC. So although the new Exynos 9820 did fairly well in testing and improved a lot over the Exynos 9810, the chip seemingly still had disadvantages against the competition when it came to power efficiency, likely linked to its process technology disadvantages. On top of the power efficiency disadvantages, the chip also had a notable die area disadvantage versus the Snapdragon, coming in at 127mm² versus the smaller 73mm² competition.

Samsung’s 7nm EUV process node was noted as having started production back in October of last year, although we’re not sure exactly which chip this was referring to, and we had hopes that it would be the chip for the S10 but alas it was not to be.

This time around, Samsung is seemingly bridging the gap with the introduction of the new Exynos 9825 – a 7nm LPP refresh of the Exynos 9820.

Samsung Exynos SoCs Specifications

Exynos 9820

Exynos 9825

CPU 2x M4 @ 2.73 GHz
2x 512KB pL2

2x Cortex A75 @ 2.31 GHz
2x 256KB pL2

4x Cortex A55 @ 1.95 GHz
No pL2's

Shared complex sL3 @ 4MB

2x M4 @ 2.73 GHz

2x Cortex A75 @ 2.4 GHz

4x Cortex A55 @ 1.95 GHz
GPU Mali G76MP12 @ 702 MHz Mali G76MP12 @ ? MHz
4x 16-bit CH
LPDDR4X @ 2093MHz
4x 16-bit CH
LPDDR4X @ 2093MHz
ISP Rear: 22MP
Front: 22MP
Dual: 16MP+16MP
Rear: 22MP
Front: 22MP
Dual: 16MP+16MP
Media 8K30 & 4K150 encode & decode
H.265/HEVC, H.264, VP9
8K30 & 4K150 encode & decode
H.265/HEVC, H.264, VP9
Integrated Modem Shannon 5000 Integrated LTE
(Category 20/13)

DL = 2000 Mbps
8x20MHz CA, 256-QAM

UL = 316 Mbps
3x20MHz CA, 256-QAM
Shannon 5000 Integrated LTE
(Category 20/13)

DL = 2000 Mbps
8x20MHz CA, 256-QAM

UL = 316 Mbps
3x20MHz CA, 256-QAM
Mfc. Process Samsung
8nm LPP
7nm LPP (EUV)

The new chip very much looks like a die-shrink/mid-cycle refresh with largely the same IP generation as the 9820, still featuring Samsung’s M4 Cheetah cores as well as a Mali-G76 GPU. Samsung also doesn’t seem to have changed the clock frequencies of the chip very much: The M4 cores are still running at a peak frequency of 2.73GHz and the A55 cores also run at 1.95GHz. We do see a bump in the frequencies of the middle cores that goes up from 2.31GHz to 2.4GHz.

On the GPU side, Samsung has also stuck with the same GPU configuration as with 9820, using a MP12 configuration of the G76. According to the company the 9825's GPU is clocked higher - so it will outperform its predecessor - however the company has yet to disclose specific clockspeeds.

As for the integrated modem, Samsung has retained their Shannon 5000, a Category 20/13 modem. This modem has a peak download rate of 2 Gbps (with 8x carrier aggregration), while uploads top out at 316 Mbps. We had been wondering if Samsung would be able to squeeze in a 5G modem for this SoC, but it looks like it's just a bit too early for that. Instead, 5G can be accomplished by pairing the SoC with Samsung's 5G Exynos Modem 5100.

The new chip is likely to be featured in the new Galaxy Note10 – Samsung will continue to use Snapdragon chips for some markets, and this could be an explanation for the new chip not having that big improvements on the part of the CPU complex as it’s aiming for performance parity with the Snapdragon. We also have to note that Samsung would have to invest the process improvements into improving power efficiency rather than raising performance.

The chip reminds us of the Exynos 5430 from a few years ago which was also a process-shrink to the chip that ended up in the Galaxy S5, representing Samsung’s first 20nm silicon. That chip never ended up in the popular flagship products, but seemingly did serve a purpose as a pipe-cleaner and learning platform for the new process node. The new Exynos 9825 could end up in a similar situation, although being used in the Note10, it won’t nearly have an as long lifespan as we don’t expect it to power the Galaxy S11 next year.

]]> Tue, 06 Aug 2019 21:30:00 EDT tag:头头体育滚球官网,14645:news
Rick Bergman Returns to AMD to Lead Computing & Graphics Business - 首页-头头体育滚球官网|英超联赛、西甲联赛、世界杯等赛事滚球直播吧! Anton Shilov

AMD has announced that Rick Bergman had rejoined the company and will lead its Computing and Graphics business. Mr. Bergman’s focus will be high-performance PCs, gaming and semi-custom businesses. The return of the former executive emphasizes importance of gaming for AMD.

Rick Bergman has a long history with GPU companies. In the late nineties he used to work at S3 Graphics and then joined ATI Technologies in 2001, where he served at various positions until 2006, when ATI was bought by AMD. From 2006 to 2011, he led AMD’s products group where he was responsible both for CPUs and GPUs. In 2011, Mr. Bergman joined Synaptics, where he served as CEO until recently and significantly transformed the company.

Among the highlights of Rick Bergman’s career at AMD are the company’s highly-successful Radeon HD 4000 and HD 5000 families of products, the GCN architecture that was used by the company’s GPUs for years, as well as AMD’s ‘Fusion’ program that enabled the company to integrate its GPUs into its CPUs and eventually create high-performance SoCs for Microsoft’s and Sony’s game consoles.

Rick Bergman is the latest addition to AMD’s graphics and gaming team. Last month AMD hired Frank Azor, a former head of Dell’s Alienware division, to head its gaming-related efforts. Meanwhile, Mr. Bergman brings both general management and semiconductor experience.

Related Reading:

Source: AMD

]]> Tue, 06 Aug 2019 17:00:00 EDT tag:头头体育滚球官网,14719:news
Samsung Unveils 6th Generation V-NAND Memory with Up to 136 Layers - 首页-头头体育滚球官网|英超联赛、西甲联赛、世界杯等赛事滚球直播吧! Anton Shilov

Samsung on Tuesday introduced its sixth-generation V-NAND memory, which in a bid to further improve capacity and density, features over 100 active layers. To make V-NAND with over 100 layers viable from performance point of view, the company had to use new circuit design technology. The new memory features 10% lower latencies and consumes 15% lower amount of power when compared to Samsung's previous-generation V-NAND.

Samsung’s 6th Generation V-NAND features up to 136 layers as well as charge trap flash (CTF) cells. The new memory uses one stack and does not use technologies like string stacking to build over 100 layers. In order to ensure minimal errors and low latencies, Samsung had to use a new speed-optimized circuit design. The latter enables the new 3D TLC 256 Gb chips to offer below 450 microseconds (μs) latency for write operations and below 45 μs for read operations, which is 10% faster when compared to 5th Generation V-NAND, according to Samsung. Meanwhile, the latest V-NAND also features lower power consumption than its predecessors.

It is noteworthy that the new 256 Gb 136-layer V-NAND devices use 670 million holes, down from 930 million holes with the previous generation, which means that the new chips need fewer process steps and are easier to manufacture. What is important is that Samsung plans to use its 136-layer architecture with speed-optimized circuit design to build V-NAND devices with over 300 layers by mounting three of the current stacks on top of each other (thus tripling a chip’s capacity).

Initially, Samsung will offer 256 Gb 3D TLC 136-layer V-NAND devices that will first be used for Samsung’s 250 GB SSDs. Later this year Samsung intends to release 512 Gb 136-layer V-NAND devices that will be used for other drives as well as eUFS storage solutions.

Speaking of the 256 GB 6th Gen V-NAND SSD, it is important to point out that it uses Samsung’s new controller marked as the S4LR030/S94G4MW2.

Related Reading:

Source: Samsung

]]> Tue, 06 Aug 2019 15:30:00 EDT tag:头头体育滚球官网,14721:news
The Fractal Design Ion+ 760P 80Plus Platinum PSU Review: A High-End PSU For the Mainstream Builder - 首页-头头体育滚球官网|英超联赛、西甲联赛、世界杯等赛事滚球直播吧! E. Fylladitakis Fractal Design is releasing their new high-end PSU series, the Ion+. The series consists of four units with power outputs ranging from 560 to 860 Watts, all with impressive specifications overall. Today we'll be taking an in-depth look at the 760W model from this family, the aptly-named Ion+ 760P, and seeing first-hand how Fractal's new PSUs live up to the company's lofty claims.

]]> Tue, 06 Aug 2019 09:00:00 EDT tag:头头体育滚球官网,14693:news
Intel to Offer Socketed 56-core Cooper Lake Xeon Scalable in new Socket Compatible with Ice Lake - 首页-头头体育滚球官网|英超联赛、西甲联赛、世界杯等赛事滚球直播吧! Dr. Ian Cutress

Today Intel is announcing some of its plans for its future Xeon Scalable platform. The company has already announced that after the Cascade Lake series of processors launched this year that it will bring forth another generation of 14nm products, called Cooper Lake, followed by its first generation of 10nm on Xeon, Ice Lake. Today’s announcement relates to the core count of Cooper Lake, the form factor, and the platform.

]]> Tue, 06 Aug 2019 08:01:00 EDT tag:头头体育滚球官网,14713:news
Toshiba Introduces New Tiny NVMe SSD Form Factor - 首页-头头体育滚球官网|英超联赛、西甲联赛、世界杯等赛事滚球直播吧! Billy Tallis

Today at Flash Memory Summit, Toshiba is debuting a new form factor for NVMe SSDs that is small enough to be a removable alternative to soldered-down BGA SSDs. The new XFMEXPRESS form factor allows for two or four PCIe lanes while taking up much less space than even the smallest M.2 22x30mm card size. The XFMEXPRESS card size is 18x14x1.4mm, slightly larger and thicker than a microSD card. It mounts into a latching socket that increases the footprint up to 22.2x17.75x2.2mm. For comparison, the standard sizes for BGA SSDs are 11.5x13mm with a PCIe x2 interface or 16x20mm with a PCIe x4 interface.

XFMEXPRESS is intended to bring the benefits of replaceable storage to devices that would normally be stuck with soldered BGA SSDs or eMMC and UFS modules. For consumer devices this opens the way for aftermarket capacity upgrades, and for embedded devices that need to be serviceable this can permit smaller overall dimensions. Device manufacturers also get a bit of supply chain flexibility since storage capacity can be adjusted later in the assembly process. XFMEXPRESS is not intended to be used as an externally-accessible slot like SD cards; swapping out an XFMEXPRESS SSD will require opening up the case of the device it's installed in, though unlike M.2 SSDs the XFMEXPRESS socket and retention mechanism itself is tool-less.

XFMEXPRESS will allow for similar performance to BGA SSDs. The PCIe x4 host interface will generally not be the bottleneck, especially in the near future when BGA SSDs start adopting PCIe gen4, which the XFMEXPRESS connector can support. Instead, SSDs in these small form factors are often thermally limited, and the XFMEXPRESS connector was designed to allow for easy heat dissipation with a metal lid that can serve as a heatspreader. Toshiba partnered with Japan Aviation Electronics Industry Ltd. (JAE) to develop and manufacture the XFMEXPRESS connector.

]]> Tue, 06 Aug 2019 08:00:00 EDT tag:头头体育滚球官网,14711:news
Everspin’s STT-MRAM Now Supported by Cadence’s DDR4 Controllers - 首页-头头体育滚球官网|英超联赛、西甲联赛、世界杯等赛事滚球直播吧! Anton Shilov

Cadence and Everspin on Monday announced that Cadence’s DDR4 IP and verification IP now support Everspin’s 1 Gb STT-MRAM. Cadence’s support will make it easier for chip designers to support MRAM.

8-bit and 16-bit DDR4 memory controllers as well as verification IP from Cadence now support Everspin’s 1 Gb STT-MRAM in a JEDEC-compliant BGA package. This enables SSD controller and flash array manufacturers to add support for MRAM to their devices. Being aimed at enterprise-class SSDs (eSSDs), Everspin’s 1 Gb STT-MRAM offers lower latencies than traditional NAND flash memory, and the manufacturer envisions their MRAM being used to significantly lower the overall latency and increase the random performance of MRAM-equipped drives versus typical SSDs.

Everspin has done quite a lot for STT-MRAM promotion. In the last couple of weeks it announced support from Phison and Sage. Now STT-MRAM is supported by Cadence. When exactly we see the fruits of this work is something that remains to be seen.

Related Reading:

Source: Everspin

]]> Mon, 05 Aug 2019 19:30:00 EDT tag:头头体育滚球官网,14709:news
Memblaze’s PBlaze5 X26: Toshiba’s XL-Flash-Based Ultra-Low Latency SSD - 首页-头头体育滚球官网|英超联赛、西甲联赛、世界杯等赛事滚球直播吧! Anton Shilov

With the annual Flash Memory Summit kicking into high gear this week, Memblaze will be showcasing one of the industry’s first ultra-low latency NVMe SSDs based on Toshiba’s XL-Flash memory. The drives promise consistent, high performance as well as ultra-low latencies and will compete against Intel’s Optane and Samsung’s Z-NAND drives for mission critical and performance-demanding applications.

The Memblaze PBlaze X26-series drives are based on Microsemi's Flashtec NVMe2016 controller and are paired with Toshiba’s XL-Flash memory. XL-Flash was announced last year, promising to reduce operational latencies by an order of magnitude compared to 3D TLC NAND (i.e., 1/10th of 3D TLC NAND latency). Memblaze claims that prototypes of the PBlaze X26-series SSDs feature a 4K random write latency under 10 μs and a 4K mixed read-write latency as low as 26 μs on average. In fact, the company expects the final drives to offer a latency of below 20 μs. This is still higher when compared to Intel’s Optane SSDs, but these SSDs are expected to be cheaper as well.

Here is what Taile Zhang, Memblaze’s senior vice president of products, said:

“Based on Memblaze’s core flash memory technology, PBlaze5 X26 brings advantages of XL-FLASH’s ultra-low latency, high QoS and provides fast, stable performance across the enterprise. Compared to 3D XPoint and other SCM media, XL-FLASH has an obvious price advantage that offers the PBlaze5 X26 series a boost for market acceptance and wide adoption across the industry.”

Memblaze is not sharing any further details about the drives at this time, yet it does reveal a product name — the PBlaze5 X26 800 — which could possible indicate an 800 GB capacity.

The manufacturer is currently sampling the drive with select customers and plans to ship commercial products in 2020.

NOTE: Image is for illustration purposes only.

Related Reading:

Source: Memblaze

]]> Mon, 05 Aug 2019 18:30:00 EDT tag:头头体育滚球官网,14708:news
Biostar Unveils Racing X570GT: An mATX Motherboard for AMD Ryzen 3000 - 首页-头头体育滚球官网|英超联赛、西甲联赛、世界杯等赛事滚球直播吧! Anton Shilov

The Micro-ATX form-factor seems to have walked into the crossfire between ATX and Mini-ITX in the recent years, and as a result, the mid-sized form factor isn't quite as prevalent as it once was. Nonetheless, since many inexpensive systems keep using mATX platforms, motherboard makers thankfully continue to support the form-factor. One of such manufacturers is Biostar, which has released its Racing X570GT Micro-ATX motherboard for AMD’s latest Ryzen 3000-series processors. This is the second mATX motherboard based on the AMD X570 chipset announced so far (as far as we are aware).

The Biostar Racing X570GT is a compact AMD X570 platform that supports AMD’s 2nd and 3rd Gen Ryzen processors and features a seven-phase digital VRM to ensure their stable operation. The motherboard carries four DDR4 memory slots for up to 128 GB of DRAM (up to DDR4-4000 speeds are supported, depending on CPU), one iron-reinforced PCIe 4.0 x16 slot for graphics cards, one M.2-2280 slot for SSDs with a PCIe 4.0 x4 interface, four SATA connectors (with RAID 0, 1, 10), and two PCIe 3.0 x1 slots for add-on cards.

On the connectivity side of matters, the motherboard has a GbE port (controlled by Realtek’s RTL8111H chip and supporting Biostar’s protection against power surges), four USB 3.1 Gen 1 Type-A along with two USB 2.0 connectors (additional USB connectors are supported via internal headers), a PS2 port, two display outputs (D-Sub and HDMI), and 7.1-channel audio connectors (enabled by Realtek’s ALC887 codec with an isolated circuit design). In addition, the motherboard features an RGB 12V LED header and a Digital 5V LED header that are used to control RGB LED strips, fans, memory modules, and so on.

Biostar’s Racing X570GT Micro-ATX motherboard does not carry any extra controllers to enable features like Wi-Fi or additional SATA ports, which will make it cheaper when compared to beefy competitors. Keeping in mind that the platform still supports the key feature of the AMD X570 platform: PCIe 4.0, the motherboard is good enough for most gamers. Unfortunately, for some reason Biostar decided not to enable USB 3.2 Gen 2 (10 Gbps) ports, but stuck to USB 3.2 Gen 1 (5 Gbps) connectors, which will be a disadvantage for those using high-performance external storage devices supporting 10 Gbps speeds.

Biostar AMD X570 Micro-ATX Motherboard
  Racing X570GT
Supported CPUs AM4
AMD's 2nd and 3rd Gen Ryzen APUs and CPUs
Graphics Integrated (APUs only)
PCIe 4.0 x16 slot
Display Outputs 1 × HDMI
1 × D-Sub
Memory 4 × DDR4 DIMM
Up to 128 GB of DDR4 (up to DDR4-4000+ in OC mode)
with or without ECC, depending on CPU
Slots for Add-In-Cards 1 × PCIe 4.0 x16
2 × PCIe 3.0 x1
Ethernet Realtek RTL8111H GbE controller
Storage M.2 1 × M.2-2280 (PCIe 4.0 x4)
SATA 4 × SATA 6 Gbps
Audio 7.1-channel audio with analog outputs (ALC887)
USB 4 × USB 3.1 Gen 1 Type-A
2 × USB 2.0  Type-A
additional ports supported by internal headers
Other I/O Internal headers for audio and USB
Monitoring ?
Bundled Software Racing GT EVO Utility
Form-Factor Micro-ATX (243 mm × 235 mm)

Biostar will start selling the Racing X570GT Micro-ATX motherboard for AMD’s Ryzen 3000-series processors in the near future. The company has not announced details about its pricing, but given its configuration, expect this to be an entry-level AMD X570-powered platform.

Related Reading:

Source: Biostar

]]> Mon, 05 Aug 2019 11:00:00 EDT tag:头头体育滚球官网,14705:news
Toshiba Launches XL-FLASH 3D SLC NAND - 首页-头头体育滚球官网|英超联赛、西甲联赛、世界杯等赛事滚球直播吧! Billy Tallis

Last year at Flash Memory Summit, Toshiba announced XL-FLASH, a specialized low-latency SLC 3D NAND flash memory that is their answer to Samsung's Z-NAND (and to a lesser extent, Intel's 3D XPoint). Few details were provided at the time, but this year Toshiba is ready to give out more information, including a timeline for bringing it to market: sampling starts next month, and mass production begins next year.

The first XL-FLASH parts will use a 128Gb die, divided into 16 planes to support a much higher degree of parallelism than existing capacity-oriented 3D NAND parts. The page size will be 4kB, significantly smaller than what most 3D NAND uses, but that's not a surprise given that XL-FLASH is storing just one bit per cell rather than three or four. Toshiba's press release does not disclose the erase block size, but we expect it to be similarly smaller than what's used in high-capacity NAND designs. As for performance, Toshiba says read latency will be less than 5 microseconds, compared to about 50 µs for their 3D TLC.

The most significant difference between Toshiba's XL-FLASH and Samsung's Z-NAND may end up being the business model. Samsung's keeping Z-NAND to themselves for use in their Z-SSD products, but Toshiba's XL-FLASH will be for sale the same as their 3D TLC and QLC NAND. We have already heard from a few SSD controller vendors that they plan to support XL-FLASH in their upcoming controllers, so when XL-FLASH starts to hit the market it will probably be arriving in SSDs from several competing brands.

Flash Memory Summit kicks off tomorrow in Santa Clara, and Toshiba will be giving the first keynote presentation.

]]> Mon, 05 Aug 2019 09:00:00 EDT tag:头头体育滚球官网,14707:news
The Eurocom Sky X7C (Clevo P775TM1-G) Gaming Laptop Review: True Desktop Replacement - 首页-头头体育滚球官网|英超联赛、西甲联赛、世界杯等赛事滚球直播吧! Brett Howse If you are thinking about a gaming laptop, but are tired of the compromises that come with normal “laptop” parts, then a Desktop Replacement laptop might be a better fit for you. Eurocom’s Sky X7C, based on the Clevo P775TM1-G chassis, offers more performance than most desktops, but still lets you carry it with you. As is typical of the boutique PC makers, there’s plenty of customization available to slot into your budget, and plenty of performance on tap as well, with insane specifications for a mobile computer.

]]> Mon, 05 Aug 2019 08:00:00 EDT tag:头头体育滚球官网,14681:news
Microchip Announces DRAM Controller For OpenCAPI Memory Interface - 首页-头头体育滚球官网|英超联赛、西甲联赛、世界杯等赛事滚球直播吧! Billy Tallis

Microchip's subsidiary Microsemi is entering a new market with the introduction of the SMC 1000 8x25G Serial Memory Controller. This is a DDR4 DRAM controller that connects to host processors using the OpenCAPI-derived Open Memory Interface (OMI), a high-speed differential serial link running at 25Gbps per lane. The purpose is to enable servers to scale to much higher memory capacities by attaching DRAM through serial links with much lower pin counts than traditional parallel DDR interfaces.

OpenCAPI is one of several competing high-speed interconnect standards that seek to go beyond the performance and feature set of PCI Express. The first two CAPI standards were built atop PCIe 3.0 and 4.0 and offered a lower-latency, cache-coherent protocol. Version 3 gained the Open- prefix by moving control of the spec from IBM to a new consortium, and OpenCAPI 3.0 abandons its PCIe underpinnings in favor of a new 25Gbps link. A subset of OpenCAPI 3.1 has been dubbed Open Memory Interface, and provides a media-agnostic but low-latency protocol for accessing memory. There's open IP available for implementing the host or target side of this interface, and a growing ecosystem of commercial tools for design verification.

The Microchip SMC 1000 8x25G unsurprisingly uses an 8-lane Open Memory Interface connection to the host, and on the downstream side it has a single-channel DDR4-3200 controller with ECC and support for four ranks of memory. The SMC 1000 at heart is a SERDES with a few extra features, allowing a CPU to use an 84-pin connection in place of a 288-pin DIMM interface, without sacrificing bandwidth and only incurring an extra 4ns of latency compared to LRDIMMs attached to an on-CPU memory controller. The chip itself is a 17x17 mm package with typical power consumption below 1.7W, and it supports dynamically dropping down to four or two lanes on the OMI link to save power when the full 25GB/s isn't needed.

In principle, the DRAM interface of the SMC 1000 could fan out to traditional DIMM slots, but the preferred way to use the chip will be to put the controller and a fixed amount of DRAM together onto a module called a Differential DIMM. These DDIMMs will use the same SFF-TA-1002 connector as EDSFF/Ruler SSDs, and the modules will be 85mm long compared to 133mm LRDIMMs. Both 1U and 2U height DDIMM form factors are in the process of being standardized. Microchip already has Samsung, Micron and SMART Modular on board to manufacture DDIMMs using the SMC 1000 controller, with initial capacities ranging from 16GB to 256GB per module.

On the host side, the first platforms to support Open Memory Interface will be POWER9 processors from IBM, and they are expected to announce more details later this month at their OpenPOWER Summit. From IBM's perspective, supporting Open Memory Interface allows them to include more memory channels on the same size die, and provides a forward-compatible upgrade path to DDR5 and NVDIMMs or other memory technologies since the details of those interfaces are now handled on the DDIMM instead of on the CPU.

Microchip will be showing off the SMC 1000 8x25G at Flash Memory Summit this week, and will be giving a keynote presentation Wednesday morning.

]]> Mon, 05 Aug 2019 08:00:00 EDT tag:头头体育滚球官网,14706:news
Phison to Showcase PS5013-E13T BGA SSD: Up to 1.7 GB/s At Under 2 W - 首页-头头体育滚球官网|英超联赛、西甲联赛、世界杯等赛事滚球直播吧! Anton Shilov

Phison said this week that it will demonstrate its next generation turnkey BGA SSD at the 2019 Flash Memory Summit next week. The tiny drive uses a 324-ball BGA packaging, and promises to be faster than its BGA predecessor while consuming around half the power.

The Phison PS5013-E13T 1113 BGA SSDs come in 128 GB and 256 GB configurations, use a PCIe 3.0 x2 interface, and iare rated for up to 1.7 GB/s sequential read speeds as well as up to 1.1 GB/s sequential write speeds (when pSLC caching is used). The drives do not use DRAM and rely on Host Memory Buffer (HMB) instead.

When compared to Phison’s current-generation PS5008-E8T BGA SSD (rated for up to 1550/950 MB/s read/write speeds), the new PS5013-E13T is not radically faster. However, its key advantage of the new one over its predecessor and existing BGA SSDs is power consumption. The new drive consumes only about 1.5 W, down from 2.9 W3.4 W consumed by today’s high-end BGA SSDs. Furthermore, the drive supports configurable power profiles to meet requirements of various applications.

Phison’s PS5013-E13T 1113 BGA SSDs will be available sometimes in 2020 and hopefully the company will reveal more information about the new drives at FMS next week.

Related Reading:

Source: Phison

]]> Fri, 02 Aug 2019 13:00:00 EDT tag:头头体育滚球官网,14704:news
Liqid to Demonstrate Element LQD4500 PCIe 4.0 x16 SSD: 32 TB At Up to 24 GB/s - 首页-头头体育滚球官网|英超联赛、西甲联赛、世界杯等赛事滚球直播吧! Anton Shilov

Liqid, a maker of SSDs for mission critical and performance-hungry applications, plans to demonstrate one of the world’s first PCIe 4.0 x16 solid-state drives at Flash Memory Summit next week. The Element LQD4500 SSD is designed to offer superior sequential and random performance along with an enterprise-grade feature set and reliability. Making this all the more noteworthy is that the drive is based on consumer-grade components.

The Liqid Element LQD4500 SSD is based on multiple Phison PS5016-E16 controllers (with a PCIe 4.0 x4 interface) featuring a custom firmware and carries up to 32 TB of raw 3D TLC NAND flash. Liqid is presumably doing on-card NVMe RAID here, similar to what we've seen in some PCIe 3.0 x16 cards in the last couple of years. Being aimed at datacenters or enterprises, the Element LQD4500 supports power loss data protection and features numerous proprietary technologies from Liqid, including active telemetry monitoring, advanced error recovery, and active thermal throttling.

The fastest Liqid Element LQD4500 SSDs will offer up to 24 GB/s sequential read and write speeds as well as up to 4 million read and write IOPS (sustained random writes are rated at 600K IOPS). Such drives will also offer an ~80 μs read access latency as well as a ~20 μs write latency.

The drive comes in a full-height full-length (FHFL) add-in-card (AIC) form-factor with a one-wide passive cooling system, and is therefore compatible with large systems that need extreme performance and can provide a minimum of 400 LFM of air flow, as the card consumes and dissipates up to 65 W of power. Depending on customer requirements, the drive can be configured for different capacities, performance, and endurance levels.

General Specifications of the Liqid Element LQD4500 SSD
  Data Center Drives Enterprise Drives
SKUs 7.68 TB: LQD-E2DPNBD08M007T68
15.36 TB: LQD-E2DPNBD08M015T36
30.72 TB: LQD-E2DPNBD08M030T72
6.40 TB: LQD-E2DPNBD08M006T40
12.80 TB: LQD-E2DPNBD08M012T80
25.60 TB: LQD-E2DPNBD08M025T60
Controller 8x Phison PS5016-E16
Form-Factor, Interface Full-height full-length (FHFL) add-in-card (AIC)
PCIe 4.0 x16, NVMe 1.3
Sequential Read up to 24 GB/s
Sequential Write up to 24 GB/s
Random Read IOPS up to 4M IOPS
Random Write IOPS up to 4M IOPS
Sustained Random Write IOPS 600K IOPS
Pseudo-SLC Caching ?
DRAM Buffer Yes, capacity unknown
AES Data Encryption Yes
Power Consumption up to 65 W
Warranty 3 years
Compatibility Windows, Windows Server 2012, 2012 R2 RHEL; SLES; CentOS, Solaris, SUSE, VMware
TBW up to 61.53 PBW
Additional Information Link
MSRP ? ?

The Liqid Element LQD4500 SSD will be demonstrated at FMS by Phison, which happens to be an investor of Liqid. There is no word regarding availability or pricing of these drives, but given their performance and capabilities, we're not expecting this card to come cheap.

Related Reading:

Sources: Liqid, Phison

]]> Fri, 02 Aug 2019 11:00:00 EDT tag:头头体育滚球官网,14703:news
Western Digital: Nearly All NAND Capacities Resumed Normal Operations - 首页-头头体育滚球官网|英超联赛、西甲联赛、世界杯等赛事滚球直播吧! Anton Shilov

Western Digital and its manufacturing partner Toshiba Memory Co. (TMC) had managed to resume normal operation of almost all of their joint production lines at their Yokkaichi Operations campus in Japan, Western Digital said on Wednesday. Damages to wafer and manufacturing tools will cost Western Digital up to $339 million in total.

A 13-minute unexpected power outage in the Yokkaichi province in Japan on June 15 affected the manufacturing facilities jointly operated by Western Digital and TMC. The incident damaged wafers that were processed and also production equipment used by the companies. Western Digital said in late June that the accident would reduce its NAND flash wafer supply in Q3 by approximately 6 EB (exabytes), which was believed to be about a half of the company’s quarterly supply of NAND. Toshiba also confirmed that wafers and equipment was damaged, but did not elaborate.

By now, virtually all production capacities at the Yokkaichi Operations are back online, according to Steve Milligan, chief executive of Western Digital.

“Western Digital and TMC teams have worked diligently on recovery activities and as of now, nearly all of the equipment in the fabs has returned to normal operations.”

The company believes that all the lost wafers will be contained in the September quarter, but the incurred damages will be quite vast. In Q4 FY2019 (Q2 C2019) the company took a $145 million charge for impacted equipment as well as operations, and plans to take another $170 – $190 million write-off in the September quarter. As a result, the impact on Western Digital will total $315 – $339 million.

Being a private company, Toshiba Memory does not disclose the impact of the accident, but if the company lost the equal number of wafers and has had to restore its production capacities, so its losses will be comparable to those of Western Digital. Overall, the 13-minute power outage will cost the two companies $630 to $678 million.

Related Reading:

Source: Western Digital

]]> Thu, 01 Aug 2019 16:00:00 EDT tag:头头体育滚球官网,14702:news
Marvell Announces Client SSD Controllers With PCIe Gen4 - 首页-头头体育滚球官网|英超联赛、西甲联赛、世界杯等赛事滚球直播吧! Billy Tallis

Last year Marvell announced updated client NVMe controllers that we have not yet encountered in the retail SSD market, but now that the transition to PCIe gen4 is underway those controllers are already due for replacement. The new family of controllers reflect shifts in the market that Marvell is expecting, and are intended more for OEM SSDs than retail products. (Silicon Motion and Phison have almost completely displaced Marvell from the retail consumer SSD market.)

As NAND flash interface speeds and per-die capacities are increasing, Marvell is betting that mainstream client NVMe products can get away with just four NAND channels rather than eight. They're also making DRAMless SSDs (optionally with NVMe Host Memory Buffer support) a bigger part of their strategy. Those two changes combined means controllers can be physically much smaller, and Marvell expects shorter M.2 cards like the 22x30mm size to become much more popular now that they can offer higher performance and capacities up to 2TB (when using QLC NAND).

Marvell's new generation of client NVMe controllers consists of three products: DRAMless controllers with two or four lanes of PCIe gen4, and one controller with DRAM support and four lanes of PCIe gen4. All three controllers have four NAND channels, but the largest 88SS1321 that has the DRAM interface also has twice as many chip enables on the NAND channels and thus can support higher capacities than the DRAMless 88SS1322 and 88SS1323.

Marvell Client NVMe SSD Controller Comparsion
  88SS1321 88SS1322 88SS1323 88SS1084 88SS1100 88SS1093
Market Segment Consumer, Entry-level Datacenter Mainstream Consumer Mainstream Consumer High-end Consumer Consumer &
12nm FFC 28nm
CPU Cores 3x Cortex R5 4x Cortex R5 3x Cortex R5
Host Interface PCIe 4.0 x4 PCIe 4.0 x2 PCIe 3.0 x4 PCIe 3.0 x4
NAND Interface 4 channels,
4 channels,
8 channels, 800MT/s 8 channels, 533MT/s
Sequential Read 3.9 GB/s 3.9 GB/s 3.5 GB/s 3.0 GB/s 3.6 GB/s 3.2 GB/s
Sequential Write 3.3 GB/s 3.3 GB/s 3.0 GB/s 2.6 GB/s 3.0 GB/s 2.0 GB/s
4KB Random Read 690k IOPS 500k IOPS 450k IOPS 450k IOPS 780k IOPS 300k IOPS
4KB Random Write 500k IOPS 350k IOPS 300k IOPS 400k IOPS 650k IOPS 250k IOPS
Announced August 2019 June 2018 August 2014

The sequential IO performance of the new 4-channel controllers is only slightly better than Marvell's earlier 8-channel controller, and random IO has taken a step backward. Marvell isn't aiming to saturate a PCIe 4 x4 link, though the smallest 88SS1323 with only a PCIe 4 x2 link does hit the speeds we're used to seeing from PCIe 3 x4 SSDs.

Instead, Marvel is touting that they have the most power-efficient PCIe Gen4-capable SSD controllers, addressing concerns raised by AMD's latest chipsets and the Phison E16 SSD controller about PCIe 4 being a power hog. Marvell's new DRAMless controllers run at less than 2W with a PCIe 4 x4 link active, which isn't much more than the NAND flash itself requires. This is made possible by Marvell's jump to 12nm fabrication, compared to 28nm that has been the standard for most NVMe controllers. Even though these controllers are using a relatively advanced fab process, Marvell says they will allow for very cost-effective SSDs, especially when used in DRAMless configurations.

Aside from the faster PCIe and NAND interfaces, the new generation of controllers are architecturally similar to their predecessors, with a handful of Arm Cortex R5 CPU cores and the same fourth-generation LDPC engine used by last year's controllers from Marvell.

Marvell is currently sampling the new controllers, and will be showing them off next week at Flash Memory Summit.



]]> Thu, 01 Aug 2019 15:00:00 EDT tag:头头体育滚球官网,14701:news
G.Skill Reveals Trident Z Neo DDR4-3800 CL14 Kit for AMD Ryzen 3000 - 首页-头头体育滚球官网|英超联赛、西甲联赛、世界杯等赛事滚球直播吧! Anton Shilov

G.Skill has introduced its new high-end Trident Z Neo memory kits for systems based on AMD’s latest Ryzen 3000 processors. According to G.Skill, its Trident Z Neo DDR4-3800 CL14 kits reach up to 58 GB/s in measured memory bandwidth.

AMD says — and many third-party observers confirm — that its Ryzen 3000 CPUs based on the Zen 2 microarchitecture show the highest memory subsystem performance when frequencies of Infinity Fabric (fClk), memory controller (uClk), and DRAM (mClk) are equal (i.e., the fClk to mClk ratio is set at 1:1). However, far not all Ryzen processors can support high fClk clocks, so using extremely fast DDR4 memory modules (e.g., DDR4-4000+) may be detrimental in many cases. G.Skill says that its Trident Z Neo DDR4-3800 kit, which runs at CL14-16-16-36 timings at a toasty 1.5 V, offers an optimal combination of high clocks, low latency, and fClk to mClk ratio of 1:1 for AMD’s latest CPUs.

G.Skill’s Trident Z Neo DDR4-3800 CL14 8 GB modules (F4-3800C14-8GTZN) are based on Samsung’s 8 Gb B-die memory chips and use a custom PCB. The unbuffered DIMMs come with aluminum heat spreaders as well as RGB LEDs. To set up rather extreme clocks and low latencies, users will need to enable an XMP 2.0 profile.

Apart from the combination of frequency and timings, a key feature of the Trident Z Neo DDR4-3800 CL14 modules is their unprecedented voltage of 1.5 Volts, a 25% increase over DDR4 specification (1.2 Volts), that is only supported properly on high-end platforms equipped with a high-quality VRM. The module maker itself has validated its new DIMMs with ASUS ROG Crosshair VIII Formula as well as MSI MEG X570 Godlike motherboards that run AMD’s Ryzen 5 3600X or Ryzen 9 3900X CPUs.

According to G.Skill, internal tests revealed that a memory subsystem comprising of an AMD Ryzen 3000 processor as well as its Trident Z Neo DDR4-3800 CL14 modules can hit 58 GB/s, 56 GB/s, and 58 GB/s of memory bandwidth for read, write, and copy benchmarks respectively.

G.Skill will supply its Trident Z Neo DDR4-3800 CL14 8 GB DIMMs in 16 GB or 32 GB dual-channel memory kits. The kits will hit the market shortly, their MSRPs will depend on demand and supply.

Related Reading:

Source: G.Skill

]]> Thu, 01 Aug 2019 14:00:00 EDT tag:头头体育滚球官网,14696:news
LG Unveils New UltraFine 4K & 5K Monitors: Now with iPad Pro Support - 首页-头头体育滚球官网|英超联赛、西甲联赛、世界杯等赛事滚球直播吧! Anton Shilov

LG has updated its UltraFine lineup of displays, which are aimed especially at computers made by Apple. The entry-level UltraFine 4K has received a larger screen, whereas the more advanced UltraFine 5K has gained a USB Type-C port. Both monitors are now compatible with Macs as well as the latest iPad Pro tablets, enabling owners of the latter to use them as desktops.

The new entry-level LG UltraFine 4K monitor is now based on a 23.7-inch IPS panel featuring a 3840×2160 resolution, 500 nits brightness, a 60 Hz refresh rate, and the usual 178°/178° horizontal/vertical viewing angles. The display comes with integrated stereo speakers, and an built-in PSU. When compared to the original UltraFine 4K introduced in 2016, the new LCD is bigger, but its resolution is the same, and as a result the pixel density got lower.

The larger LG UltraFine 5K display uses a 27-inch IPS panel featuring a 5120×2880, 500 nits brightness, a 60 Hz refresh rate, and 178°/178° horizontal/vertical viewing angles. The new LCD is equipped with a webcam, built-in stereo speakers and a microphone, as well as an integrated power supply. In an important change, this model now no longer requires a Thunderbolt 3 connection; the monitor can be used with a USB-C port as well (with DP alt mode), making it compatible with a wider range of devices, and likely indicating that LG has upgraded to Intel's Titan Ridge TB3 controller.

As these monitors are primarily meant to be used with Apple products, LG’s UltraFine monitors only support the P3 color gamut – where Apple offers very robust OS-level support – and are compatible with Apple’s latest Macs as well as 2019 iPad Pro tablets, making this the first time these displays have worked with an iPad. Both displays can connect to hosts using a Thunberbolt 3 or a USB 3.1 Gen 1 Type-C ports that can deliver up to 85 W or 94 W of power to a laptop or a tablet.

LG's 2019 UltraFine Displays
  LG UltraFine 4K LG UltraFine 5K
Panel 23.7" IPS 27" IPS
Native Resolution 3840 x 2160 5120 x 2880
Refresh Rate 60 Hz
Brightness 500 cd/m²
Color Gamut Display P3
Color Depth 8 bit (?) 10 bit (?)
Viewing Angles 178°/178° horizontal/vertical
Inputs Thunderbolt 3 or USB-C
USB Hub 3 x 5Gbps USB-C
Audio Stereo speakers Stereo speakers
Webcam - Integrated
Stand Adjustable stand
Power Delivery 85 W 94 W
Price $699.95 $1,299.95

The new LCDs are currently available from Apple. The LG UltraFine 4K 23.7-inch display is priced at $699.95, whereas the UltraFine 5K 27-inch monitor is priced at $1,299.95.

Related Reading:

Source: LG

]]> Thu, 01 Aug 2019 13:00:00 EDT tag:头头体育滚球官网,14698:news